Silicon Wafer Cutting Blade

Silicon Wafer Cutting Blade

This blade cuts monocrystalline and polycrystalline silicon ingots, bricks and square or round stock. Diamond grit is electroplated onto a high-tensile stainless steel backing.
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Description

Product Introduction

 

Electroplated diamond bandsaw blade for monocrystalline and polycrystalline silicon

This blade cuts monocrystalline and polycrystalline silicon ingots, bricks and square or round stock. Diamond grit is electroplated onto a high-tensile stainless steel backing. The edge is supplied continuous for low-chipping wafer cuts, or segmented where coolant flow and silicon debris evacuation are the limiting factor. Widths run 10–80 mm; grit 35/40 or 50/60; loop length is welded to the machine wheel diameter. Water or coolant is required during cutting.

 

Silicon Wafer Cutting Blade

 

Specifications

Item Data
Abrasive Diamond
Bonding Electroplated
Backing High-tensile stainless steel
Width 10–80 mm standard; narrower widths down to 3 mm quoted on request
Grit 35/40, 50/60
Edge type Continuous / Segmented
Loop length Welded to machine model and wheel diameter
Cutting condition Wet cutting with water or coolant
Application Monocrystalline and polycrystalline silicon ingot, brick and square/round stock slicing
MOQ 5 blades
Customization Width, grit, edge type, loop length, laser marking, private-label packaging

 

Construction and inspection

 

Diamond grit is electroplated onto the stainless backing. The grit layer is checked before packing; the backing width and thickness are fixed before plating. Continuous edge gives a closed cutting edge for low-chipping cuts. Segmented edge opens clearance for coolant and silicon debris in thicker sections. Loops are welded to the requested length, and joint alignment is checked before packing.

Inspection covers backing width and thickness, grit size, edge profile and weld joint dimensions. Sipu uses an image measuring instrument for edge and width checks, a spectrometer for stainless steel batches, and metallographic analysis for steel batch verification. Each blade is coated with anti-rust oil and wrapped with VCI paper. Sea freight shipments use reinforced plywood crates.

 

Application fit

 

  • Monocrystalline silicon ingot and brick slicing.
  • Polycrystalline silicon ingot and brick slicing.
  • Silicon square and round stock; wafer-adjacent cuts where edge chipping is controlled by coolant, feed and grit selection.
  • Quartz, glass, technical ceramics and sapphire cuts where the same electroplated diamond edge is used.

Continuous edge is the starting point for silicon wafer cuts where chipping limits are tight. Segmented edge is used when coolant flow and debris evacuation in thicker cuts matter more than edge continuity. Grit 35/40 removes stock faster; 50/60 leaves a finer cut surface when feed and coolant are stable.

 

Ordering and customization

 

Sipu has produced bandsaw blades since 2012 and exports to more than 150 countries. OEM/ODM work includes laser marking, private-label packaging and non-standard loop lengths. MOQ is 5 blades; sample orders are accepted for quality testing. Standard widths and grits ship within 48 hours from stock when available. Custom loops and OEM runs take 7–14 working days. Payment terms: T/T, L/C, Western Union; OEM orders normally 30% deposit, 70% before shipment.

 

FAQ

Q: Which grit should I use for silicon ingot or brick cutting?

A: Start with 35/40 where stock removal is the priority. Use 50/60 when surface finish and edge chipping are the main limits and the machine can hold stable feed and coolant flow. Send the silicon grade, ingot/brick size and target cut quality for a grit recommendation.

Q: Continuous or segmented edge for silicon wafer cuts?

A: Continuous edge is typical for silicon wafer cuts with tight chipping limits. Segmented edge is specified when coolant flow and debris evacuation in thicker cuts are the main constraint. The two edges are not interchangeable without checking feed, coolant pressure and cut depth.

Q: Can the blade run without coolant?

A: No. Silicon cutting with an electroplated diamond blade requires water or coolant. Dry running overheats the plating and the cut zone, and it increases chipping and blade wear.

Q: Can you weld the loop to our machine and laser-mark our brand?

A: Yes. Provide the machine model, wheel diameter, blade width and grit. Loops are welded to length and joint alignment is checked. Laser marking and private-label packaging are available for bulk orders; MOQ is 5 blades.

Q: What is the lead time and export packing?

A: Standard widths and grits ship within 48 hours from stock when available. Custom loops and OEM orders take 7–14 working days. Blades are packed with anti-rust oil and VCI paper; sea freight uses reinforced plywood crates. Shipping is by sea FCL/LCL, air, or DHL/FedEx/UPS.

 

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