Product Introduction
Diamond band saw blades are used for continuous band cutting of stone and other high-hardness, brittle materials.

Features
Suitable for cutting high-hardness materials
Diamond abrasive grains have a hardness of approximately 9.5 Mohs, higher than materials such as quartz and ceramics. Grinding removes imperfections, enabling continuous cutting of high-hardness materials.
Strong abrasive grain retention capability
The electroplated metal layer mechanically embeds the diamond grains, reducing the probability of abrasive grain detachment compared to resin-bonded structures.
Materials suitable for wet cutting environments
The stainless steel substrate uses chromium to form a passivation film, reducing the effects of oxidation and corrosion under water-cooled or wet cutting conditions.
Applications
Stone Processing Industry: Used for continuous cutting of slabs or irregularly shaped parts such as granite and marble, achieving raw material segmentation and dimensional shaping.
Electronic and Optical Materials Processing: Used for cutting quartz glass and ceramic substrates, providing a basic shape for subsequent precision machining.
Hard Materials Manufacturing Industry: Applied to cutting high-hardness materials such as silicon carbide, achieving blank separation or dimensional pre-processing.
FAQ
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